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10/15/2019
3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements
This paper proposes 3D field simulation models for different designs of ...
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12/17/2018
Proper Generalized Decomposition of Parameterized Electrothermal Problems Discretized by the Finite Integration Technique
The proper generalized decomposition is applied to a static electrotherm...
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09/24/2018
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging
This work addresses the simulation of heat flow and electric currents in...
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09/23/2018
